KOVTUN, I., PETRASHCHUK, S. and BOIKO, J. (2022) “INFLUENCE OF THE SEALING ON APPEARANCE AND TRANSMISSION OF TEMPERATURE DEFORMATIONS IN ELECTRONIC MODULES”, Herald of Khmelnytskyi National University. Technical sciences, 309(3), pp. 150–157. doi:10.31891/2307-5732-2022-309-3-150-157.