KOVTUN, Igor; PETRASHCHUK, Svitlana; BOIKO, Juliy. INFLUENCE OF THE SEALING ON APPEARANCE AND TRANSMISSION OF TEMPERATURE DEFORMATIONS IN ELECTRONIC MODULES. Herald of Khmelnytskyi National University. Technical sciences, [S. l.], v. 309, n. 3, p. 150–157, 2022. DOI: 10.31891/2307-5732-2022-309-3-150-157. Disponível em: https://heraldts.khmnu.edu.ua/index.php/heraldts/article/view/1179. Acesso em: 26 jan. 2026.